Multi-material structural adhesive, heat or room temperature curing.
Epoxy glue is a structural glue mainly intended for industrial assembly and multi-material assemblies. Thanks to its strong adhesive power, epoxy adhesive offers a superior mechanical resistance to industrial assemblies. Thus, it meets the increasingly demanding bonding applications of high-tech industries.
Epoxy adhesives are available in one-component and two-component bases. In the first case, the reactive resin cures at high temperatures, while the two-component resin cures at room temperature. The epoxy adhesive offers a real alternative to the traditional assembly processes: riveting, welding and stirring.
These different types of epoxy resins are used in particular in the production of smart cards and RFID labels as well as for bulky or heat-sensitive components.
|KEOL-EP 4031||Silver||9 000||-||-||-|
|KEOL-PARBOND 5615||-||50 000||75D||-||16|